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| ECLLQFP32EVB Evaluation Board Manual for High Frequency LQFP32 http://onsemi.com EVALUATION BOARD MANUAL INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 32-lead LQFP package. These evaluation boards are offered as a convenience for the customers interested in performing their own engineering assessment on the general performance of the 32-lead LQFP device samples. The board provides a high bandwidth 50 W controlled impedance environment. Figures 1 and 2 show the top and bottom view of the evaluation board, which can be configured in several different ways, depending on device under test (see Table 1. Configuration List). This evaluation board manual contains: This manual should be used in conjunction with the device data sheet, which contains full technical details on the device specifications and operation. Board Lay-Up * * * * Information on 32-lead LQFP Evaluation Board Assembly Instructions Appropriate Lab Setup Bill of Materials The 32-lead LQFP evaluation board is implemented in four layers with split (dual) power supplies (see Figure 3. Evaluation Board Lay-Up). For standard ECL lab setup and test, a split (dual) power supply is essential to enable the 50 W internal impedance in the oscilloscope as a termination for ECL devices. The first layer or primary trace layer is 0.008 thick Rogers RO4003 material, which is designed to have equal electrical length on all signal traces from the device under the test (DUT) to the sense output. The second layer is the 1.0 oz copper ground. The FR4 dielectric material is placed between second and third layer and between third and fourth layer. The third layer is the power plane (VCC & VEE) and a portion of this layer is a ground plane. The fourth layer is the secondary trace layer. Figure 1. Top View of the 32-lead LQFP Evaluation Board (c) Semiconductor Components Industries, LLC, 2003 1 April, 2003 - Rev. 1 Publication Order Number: ECLLQFP32EVB/D ECLLQFP32EVB Bottom View Enlarged Bottom View Figure 2. Bottom View of the 32-lead LQFP Evaluation Board LAY-UP DETAIL 4 LAYER SILKSCREEN (TOP SIDE) LAYER 1 (TOP SIDE) 1 OZ ROGERS 4003 0.008 in LAYER 2 (GROUND PLANE P1) 1 OZ FR-4 0.020 in LAYER 3 (GROUND, VCC & VEE, PLANE P2) 1 OZ FR-4 0.025 in LAYER 4 (BOTTOM SIDE) 1 OZ 0.062 $ 0.007 Figure 3. Evaluation Board Lay-up Board Layout The 32-lead LQFP evaluation board was designed to be versatile and accommodate several different configurations. The input, output, and power pin layout of the evaluation board is shown in Figures 4 and 5. The evaluation board has at least thirteen possible configurable options. Table 1, list the devices and the relevant configuration that utilizes this PCB board. Lists of components and simple schematics are located in Figures 6 through 18. Place SMA connectors on J1 through J32, 50 W chip resistors between ground pad and Pin 1 pad through Pin 32 pad, and chip capacitors C1 through C5 according to configuration figures. (C4 and C5 are 0.01 mF and C1, C2, and C3 are 0.1 mF); (See Figure 5). http://onsemi.com 2 ECLLQFP32EVB Top View Bottom View Figure 4. Evaluation Board Layout http://onsemi.com 3 ECLLQFP32EVB Pin 25 Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 31 Pin 32 VEE VCC C5 Pin 24 Pin 23 Pin 22 Pin 21 Pin 20 Pin 19 Pin 18 Pin 17 Ground Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 C4 Pin 15 Pin 14 Pin 13 Pin 12 Pin 10 Pin 11 Figure 5. Enlarged Bottom View of the Evaluation Board Table 1. Configuration List Configuration 1 2 3 4 5 6 7 8 9 10 11 12 13 Comments See Figure 6 See Figure 7 See Figure 8 See Figure 9 See Figure 10 See Figure 11 See Figure 12 See Figure 13 See Figure 14 See Figure 15 See Figure 16 See Figure 17 See Figure 18 Device LVE164 EP016 / EP016A EP101 / EP105 EP116 EP131 EP142 EP195 / EP196 EP445 EP446 EP451 EP809 LVEP111 / LVEP210 LVEP210S Pin 16 http://onsemi.com 4 Pin 9 ECLLQFP32EVB Evaluation Board Assembly Instructions The 32-lead LQFP evaluation board is designed for characterizing devices in a 50 W laboratory environment using high bandwidth equipment. Each signal trace on the board has a via, which has an option of placing a termination resistor depending on the input/output configuration (see Table 1, Configuration List). Table 17 contains the Bill of Materials for this evaluation board. Solder the Device on the Evaluation Board It is recommended to solder 0.01 mF capacitors to C4 and C5 to reduce the unwanted noise from the power supplies. C1, C2, and C3 pads are provided for 0.1 mF capacitor to further diminish the noise from the power supplies. Adding capacitors can improve edge rates, reduce overshoot and undershoot. Termination The soldering can be accomplished by hand soldering or soldering re-flow techniques. Make sure pin 1 of the device is located next to the white dotted mark and all the pins are aligned to the footprint pads. Solder the 32-lead LQFP device to the evaluation board. Connecting Power and Ground Planes For standard ECL lab setup and test, a split (dual) power supply is required enabling the 50 W internal impedance in the oscilloscope to be used as a termination of the ECL signals (VTT = VCC - 2.0 V, in split power supply setup, VTT is the system ground, VCC is 2.0 V, and VEE is -3.0 V or -1.3 V; see Table 2, Power Supply Levels). Table 2. Power Supply Levels Power Supply 5.0 V 3.3 V 2.5 V VCC 2.0 V 2.0 V 2.0 V VEE -3.0 V -1.3 V -0.5 V GND 0.0 V 0.0 V 0.0 V All ECL outputs need to be terminated to VTT (VTT = VCC -2.0 V = GND) via a 50 W resistor. 0402 chip resistor pads are provided on the bottom side of the evaluation board to terminate the ECL driver (More information on termination is provided in AN8020). Solder the chip resistors to the bottom side of the board between the appropriate input of the device pin pads and the ground pads. For ease of assembly, it is advised to place and solder termination resistors on its vertical (side) position, instead of its original or flat position. Installing the SMA Connectors Each configuration indicates the number of SMA connectors needed to populate an evaluation board for a given configuration. Each input and output requires one SMA connector. Attach all the required SMA connectors onto the board and solder the connectors to the board on J1 through J32. Please note that alignment of the signal connector pin of the SMA can influence the lab results. The reflection and launch of the signals are largely influenced by imperfect alignment and soldering of the SMA connector. Validating the Assembled Board Connect three banana jack sockets to VCC, VEE, and GND labeled holes. Wire bond the appropriate device pin pad on the bottom side of the board to VCC and VEE power stripes. (Device specific, please see configuration for each desired device. See Figure 5) After assembling the evaluation board, it is recommended to perform continuity checks on all soldered areas before commencing with the evaluation process. Time Domain Reflectometry (TDR) is another highly recommended validation test. http://onsemi.com 5 ECLLQFP32EVB CONFIGURATIONS SMA CONNECTORS J31 J30 J29 J28 J27 J26 J2 J3 J4 J5 J6 J23 J22 J21 J20 J19 BANANA JACK PLUG J9 J10 J11 J12 0603 CHIP CAPACITOR 0.1 mF J15 J13 NORMAL TOP VIEW LVE164 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW LVE164 Figure 6. Configuration 1 Table 3. Configuration 1 (Device LVE164) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Device Pin # Resistor Power J32 J11 Y Y N J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 3 Y 4 Y 5 Y Y N 6 7 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y Y YNY N N N NN NN NY Y Y Y Y Y N YNNY YNNY NNNN Y Y N Y Y YN NNNY NNYN YYY NNN YY NN YYN NNN Connector N Y YN YN NY NY NYYY NNNN NYY NNN http://onsemi.com 6 ECLLQFP32EVB SMA CONNECTORS J31 J30 J29 J27 J26 J25 J24 J2 J3 J4 J5 J6 J7 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J23 J22 J21 J20 J19 J18 J17 J10 J11 J12 NORMAL TOP VIEW EP016 / EP016A J16 J15 J14 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP016 / EP016A Figure 7. Configuration 2 Table 4. Configuration 2 (Device EP016 and EP016A) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Device Pin # Resistor Power J32 J11 J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 3 Y 4 Y 5 Y N N 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y N N YNY Y Y Y N Y Y Y Y Y Y Y N Y Y Y Y Y Y N NY NN YN YN NNYY NYNN YY NN YYY NNN YNYY NNNN NNN NNY Connector N Y NNY NNN YYN NNNN YNNN NY NN http://onsemi.com 7 ECLLQFP32EVB SMA CONNECTORS J30 J29 J27 J26 J25 J24 J2 J3 J4 J5 J6 J7 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J23 J22 J21 J20 J19 J18 J17 J11 J12 NORMAL TOP VIEW EP101 / EP105 J16 J15 J14 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP101 / EP105 Figure 8. Configuration 3 Table 5. Configuration 3 (Device EP101 and EP105) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 J31 Device Pin # Resistor Power J32 J11 J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 3 Y 4 Y 5 Y N N 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y Y N YNY Y Y Y N Y Y Y Y Y Y Y N Y Y Y Y Y Y N NY NN YN YNN NNN NYY YNYY NYNN YY NN YYY NNN YYYY NNNN Connector N Y NNN NNN YNY NNNN YNNN NN NN http://onsemi.com 8 ECLLQFP32EVB SMA CONNECTORS J31 J32 J1 J2 J3 J4 J5 J6 J7 J30 J29 J27 J26 J25 J24 J23 J22 J21 J20 J19 J18 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J10 J11 J15 J14 NORMAL TOP VIEW EP116 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP116 Figure 9. Configuration 4 Table 6. Configuration 4 (Device EP116) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Y Device Pin # Resistor Power J32 Y J11 J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 Y 3 Y 4 Y 5 Y N N 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y N N NNY Y N N Y NY NN YN Y Y Y Y Y N Y Y Y Y Y Y N NY NY YN NNNN YYNN NNN NNN YYYY NNNN YYY NNN Connector Y NNY NNN YYN YYNN NNNN NN NN http://onsemi.com 9 ECLLQFP32EVB SMA CONNECTORS J31 J32 J1 J2 J3 J4 J5 J6 J7 J8 J30 J29 J27 J26 J24 J23 J22 J21 J20 J19 J18 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J17 J10 J11 J12 NORMAL TOP VIEW EP131 J15 J14 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP131 Figure 10. Configuration 5 Table 7. Configuration 5 (Device EP131) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Y Device Pin # Resistor Power J32 Y J11 J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 Y 3 Y 4 Y 5 Y Y N 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y Y N YNY Y N N Y Y Y Y Y Y Y N N Y YNY Y Y N NY NY YN YNYY NYNN NN NN NNN NNN NNNY NNYN YYY NNN Connector Y YNY YNY NYN YYYY NNNN YY NN http://onsemi.com 10 ECLLQFP32EVB SMA CONNECTORS J31 J1 J2 J3 J4 J5 J6 J7 J8 J9 J10 J11 J12 J30 J29 J27 J26 J25 J24 J23 J22 J21 J20 J19 J18 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J15 J14 NORMAL TOP VIEW EP142 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP142 Figure 11. Configuration 6 Table 8. Configuration 6 (Device EP142) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Device Pin # Resistor Power J32 J11 J1 J2 J3 J4 J5 J6 J7 J8 8 Y J9 1 2 Y 3 Y 4 Y 5 Y Y N 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y Y Y N N YNNN NNNN NYYY N N Y NY NN YN Y Y Y Y N N Y Y Y Y Y Y N NY NY YN YN NNN NNN YYYY NNNN YYN NNY Connector Y YYYY NNNN YY NN YYN NNN http://onsemi.com 11 ECLLQFP32EVB SMA CONNECTORS J31 J32 J1 J2 J3 J4 J5 J30 J29 J27 J26 J25 J23 J21 J20 J7 J8 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J17 J10 J11 J12 J16 J15 J14 Only for EP196 NORMAL TOP VIEW EP195 / EP196 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP195 / EP196 Figure 12. Configuration 7 Table 9. Configuration 7 (Device EP195 and EP196) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Y Device Pin # J32 Y J11 J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 Y 3 Y 4 Y 5 Y Y N 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y Y N Y YNY Y Y N * N NY Y N N Y YNY Y Y Y N NY NY YN YYNY NNYN NN NY NNN YNN YNYY NYNN YYY NNN Connector Y YNY NNY NYN Resistor YYYY Power NNNN * Only for EP196 NN NN http://onsemi.com 12 ECLLQFP32EVB SMA CONNECTORS J31 J1 J2 J3 J4 J5 J6 J7 J30 J29 J27 J26 J25 J23 J22 J21 J19 J18 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J9 J10 J11 J15 J14 NORMAL TOP VIEW EP445 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP445 Figure 13. Configuration 8 Table 10. Configuration 8 (Device EP445) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Device Pin # Resistor Power J32 J11 J1 J2 J3 J4 J5 J6 J7 J8 8 Y J9 1 2 Y 3 Y 4 Y 5 Y Y N 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y Y Y N N NNY Y N N Y NY NN YN YNY NNN NYN Y Y N YNY Y Y Y N NY NN YN YN NNNN YYNN YNYY NYNN YYN NNY Connector Y YYYY NNNN NY NN NNN NNN http://onsemi.com 13 ECLLQFP32EVB SMA CONNECTORS J31 J30 J29 J27 J26 J24 J2 J3 J4 J5 J6 J7 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J23 J22 J21 J20 J19 J18 J17 J11 J12 NORMAL TOP VIEW EP446 J15 J14 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP446 Figure 14. Configuration 9 Table 11. Configuration 9 (Device EP446) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Device Pin # Resistor Power J32 J11 J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 3 Y 4 Y 5 Y N N 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y N N YNY Y N N Y Y Y Y Y Y Y Y N Y YNY Y N N NY NY YN YN NNNN NYNN YY NN YYY NNN YYNN NNYN YNN NNY Connector N Y NNN NNN YYY NYYY YNNN YY NN http://onsemi.com 14 ECLLQFP32EVB SMA CONNECTORS J31 J32 J1 J2 J3 J4 J5 J30 J29 J27 J26 J25 J24 J23 J22 J21 J20 J7 J8 J9 J10 J11 J12 NORMAL TOP VIEW EP451 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J18 J17 J15 J14 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP451 Figure 15. Configuration 10 Table 12. Configuration 10 (Device EP451) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Y Device Pin # Resistor Power J32 Y J11 J1 J2 J3 J4 J5 J6 J7 J8 8 Y J9 1 2 Y 3 Y 4 Y 5 Y Y N 6 7 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y Y Y N N YNY Y N N Y Y Y NY Y Y Y N Y Y Y Y Y Y N NY NY YN NNNN NYNN NN NN NNN YNN YYYY NNNN YYY NNN Connector Y NY NN YN YYYY NNNN NNN NNN http://onsemi.com 15 ECLLQFP32EVB SMA CONNECTORS J31 J30 J29 J28 J27 J26 J2 J3 J4 J5 J6 J23 J22 J21 J20 J19 J18 J8 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J10 J11 J12 J13 J15 J14 NORMAL TOP VIEW EP809 VEE = VCCO VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW EP809 Figure 16. Configuration 11 Table 13. Configuration 11 (Device EP809) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Device Pin # Resistor Power J32 J11 J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 3 Y 4 Y 5 Y Y N 6 7 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y N N Y Y Y Y N N Y NY NN YN Y Y Y Y N N YNNY NNNN NYYN Y N N Y Y YN NNNN NNNN NNN NNN NN NN NNN NNY Connector N Y YN YN NY YNY YNN NYN NYYY YNNN http://onsemi.com 16 ECLLQFP32EVB SMA CONNECTORS J31 J30 J29 J28 J27 J26 J24 J2 J3 J4 J23 J22 J21 J20 J6 J7 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J19 J18 J17 J10 J11 J12 J13 J15 J14 NORMAL TOP VIEW LVEP111 / LVEP210 VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW LVEP111 / LVEP210 Figure 17. Configuration 12 Table 14. Configuration 12 (Device LVEP111 and LVEP210) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Device Pin # J32 J11 J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 3 Y 4 Y 5 Y 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y N N Y Y Y Y N N Y Y Y Y Y Y Y N N Y YNY Y N N Y Y YN NNNN NNNN NN NN NNN NNN NNNN NNYN NN NN NNN NNY Connector N Y NNY NNN YYN Resistor NYYYNYY Power YNNNNNN * Pin 2 is No Connect for LVEP210 http://onsemi.com 17 ECLLQFP32EVB SMA CONNECTORS J31 J30 J29 J28 J27 J26 J24 J2 J3 J4 J23 J22 J21 J20 J6 J7 BANANA JACK PLUG 0603 CHIP CAPACITOR 0.1 mF J19 J18 J17 J10 J11 J12 J13 J15 J14 NORMAL TOP VIEW LVEP210S VEE VCC 0805 CHIP CAPACITOR 0.01 mF PIN 1 0402 CHIP RESISTOR 50 W WIRE EXPANDED BOTTOM VIEW LVEP210S Figure 18. Configuration 13 Table 15. Configuration 13 (Device LVEP210S) J10 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 J29 J30 Y J31 Device Pin # Resistor Power J32 J11 J1 J2 J3 J4 J5 J6 J7 J8 8 J9 1 2 3 Y 4 Y 5 Y Y N 6 Y 7 Y 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Y N N Y Y Y Y N N Y Y Y Y Y Y Y N N Y YNY Y N N Y Y YN NNNN NNNN NN NN NNN NNN NNNN NNYN NN NN NNN NNY Connector N Y NNY NNN YYN NYYY YNNN YY NN http://onsemi.com 18 ECLLQFP32EVB LAB SETUP Test Measuring Equipment Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 Trigger Differential Signal Generator J3 J4 J31 J30 J29 J28 D U T Out1 Out1 J27 J26 J24 J23 Trigger VCC GND VEE Power Supply Figure 19. Example of Standard Lab Setup (Configuration 12) 1. Connect appropriate power supplies to VCC, VEE, and GND. For standard ECL lab setup and test, a split (dual) power supply is required enabling the 50 W internal impedance in the oscilloscope to be used as a termination of the ECL signals (VTT = VCC - 2.0 V, in split power supply setup, VTT is the system ground, VCC is 2.0 V, and VEE is -3.0 V or -1.3 V; see Table 16). 2. Connect a signal generator to the input SMA connectors. Setup input signal according to the device data sheet. 3. Connect a test measurement device on the device output SMA connectors. NOTE: The test measurement device must contain 50 W termination. Table 16. Power Supply Levels Power Supply 5.0 V 3.3 V 2.5 V VCC 2.0 V 2.0 V 2.0 V VEE -3.0 V -1.3 V -0.5 V GND 0.0 V 0.0 V 0.0 V Table 17. Bill of Materials Components SMA Connector Banana Jack Manufacturer Johnson Components* Keystone* Description SMA Connector, Side Launch, Gold Plated Standard Jack Miniature Jack Chip Capacitor Johanson Dielectric* Panasonic* ON Semiconductor ON Semiconductor 0603 0.01 mF 0603 0.1 mF 0402 50 W 1% Precision Think Film Chip Resistor LQFP32 Evaluation Board LQFP32 Package Device Part Number 142-0701-851 6096 6090 500R14Z100MV4E 250R14Z101MV4E ERJ-2RKF49R9X ECLLQFP32EVB Various http://www.panasonic.com http://www.onsemi.com http://www.onsemi.com http://www.johansondielectrics.com Web Site http://www.johnsoncomponents.com http://www.keyelco.com Chip Resistor Evaluation Board Device Samples *Components are available through most distributors, i.e. www.newark.com, www.digikey.com. http://onsemi.com 19 ECLLQFP32EVB Top View Second Layer (Ground Plane) Figure 20. Gerber Files http://onsemi.com 20 ECLLQFP32EVB Third Layer (Power and Ground Plane) (Left side - VCC, Right side - VEE, Middle Box - Ground) Bottom Layer Figure 21. Gerber Files http://onsemi.com 21 ECLLQFP32EVB ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 22 ECLLQFP32EVB/D |
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